Home >synova lgs laser edge grinding machines

GROUP NEWS

synova lgs laser edge grinding machines

synova lgs laser edge grinding machines

Water jet guided laser cutting technology | Synova

Turnkey Systems. Synova’s state-of-the-art laser cutting machines are available in manual, semi-automatic or fully automatic versions. These high-precision cutting systems, featuring our proprietary Laser MicroJet ® technology, perform fast, accurate, omni-directional cutting with no chipping, burrs, deposition, contamination, thermal damage, material changes or mechanical stress.

Get Price

Synova: Your supplier of water jet guided laser cutting .

About Us The Synova Story . Aside from research, both the final assembly and testing of up to 100 machines a year are performed in Synova’s modern, 1800 square meter facility in Duillier. . First Laser Stencil (LSS) and Edge Grinding Systems (LGS) Relocation of international headquarters to Ecublens-Lausanne, Switzerland.

Get Price

Machine for Laser Grinding of Wafers - bovenindewolken

Synova ? LGS ? Laser Edge Grinding Machines. The Laser Microjet wafer edge grinding machine is suitable for grinding, drilling and slotting of wafers It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strengt. Read More

Get Price

LGS 200 A - Synova - PDF Catalogs | Technical .

Laser Grinding System The LGS 200 A is a fully automatic laser edge-grinding system. The LGS is able to remove the wafer edge, which contains micro-cracks from back grinding, without incurring additional damages associated with conventional cutting technologies such as

Get Price

Laser Edge Grinding System - Synova - PDF Catalogs .

Laser Grinding System The LGS 200 A is a fully automatic laser edge-grinding system. The LGS is able to remove the wafer edge, which contains micro-cracks from back grinding, without incurring additional damages associated with conventional cutting technologies such as

Get Price

Laser Grinding System - wib-wondrak.de

The LGS 200 A is a fully automatic laser edge-grinding system. The LGS is able to remove the wafer edge, which contains micro-cracks from back grinding, without incurring additional damages associated such as ‘dry’ lasers and diamond saw bla-des. Moreover, the system is easy to use with its clear Man Machine Interface (MMI) capability.

Get Price

Tool grinding machine / PLC-controlled - LGS 200A - Synova

Find out all of the information about the Synova product: tool grinding machine / PLC-controlled LGS 200A. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.

Get Price

Laser Edge Grinding System - Synova - PDF Catalogs .

Laser Grinding System The LGS 200 A is a fully automatic laser edge-grinding system. The LGS is able to remove the wafer edge, which contains micro-cracks from back grinding, without incurring additional damages associated with conventional cutting technologies such as

Get Price

Laser Grinding System - wib-wondrak.de

The LGS 200 A is a fully automatic laser edge-grinding system. The LGS is able to remove the wafer edge, which contains micro-cracks from back grinding, without incurring additional damages associated such as ‘dry’ lasers and diamond saw bla-des. Moreover, the system is easy to use with its clear Man Machine Interface (MMI) capability.

Get Price

Cutting Diamond Tools By Laser MicroJet | Drupal

The Synova LCS 50-5 laser machining process delivers an extremely fine surface finish (Ra ≤ 0,3 micron) for PCD tools, which eliminates the need for a second grinding operation. In addition, the machine’s 5-axis capability is in a position to execute CNC programs with the high degree of precision needed for such cutting tools.

Get Price

S Metal Watches EPMT-2015-english-swissphotonics

Synova Confidential Products Laser Dicing System (LDS) Laser Edge-Grinding System (LGS) with DIT Hybrid Laser Saw (HLS) with Disco Loading system Dicing / trimming / scribing of wafers Laser Cutting System (LCS) General purpose Diamond Cutting System (DCS) Laser Drilling System with Posalux Cutting of diamonds Machines with Manufacturing Partners

Get Price

Synova receives multiple-system orders from Korean .

January 31--Synova announced tool orders from a Korean organic light-emitting diode (OLED) manufacturer and a leading U.S.-based semiconductor manufacturer's Korean facility.The first order was placed for the company's Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the company's Laser Grinding System, LGS 200A, for thin wafer edge grinding.

Get Price

LCS-50 - Sai Impex

The LCS 50 is Synova’s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is designed for machining industrial diamond tools and other small work pieces that require precision cutting, drill- ling, grooving or slicing.

Get Price

Precision cutting and grooving with the Laser MicroJet

Synova SA, Switzerland Precision cutting and grooving with the Laser MicroJet. EPMT 2010 2 Outline Company – Products – Markets Laser MicroJet principle . EPMT 2010 3 Founded: 1997 Headcount: 60 employees Company. EPMT 2010 4 Products Laser Dicing System (LDS) Laser Grinding System (LGS) Hybrid Laser Saw (HLS) w/ Disco Corp. Cutting .

Get Price

Laser machines for cutting edge processing | Drupal

EDM machines; EDM wire; Laser processing . Laser machines for chip breaker production; Laser machines for creating blank cuts; Laser machines for cutting edge processing; Laser marking; Marking as a service; Materials for tool production . Blanks for HSS tools; Blanks for tungsten carbide tools; CBN powder / grit; CVD diamond; Carbon wheel .

Get Price

Synova's success – Electronics – Case Study - Matrox

The machines on offer use the water-jet-guided laser technology (also called Laser-Microjet) for various micro-machining operations such as wafer dicing and edge grinding for the semiconductor industry, and cutting of hard materials such as CBN and PCD, PV solar

Get Price

wendt grinding machine laser - kidl.net

synova lgs laser edge grinding machines. wendt grinding machine laser grinding machine for dressing turbine tips WENDT Group - Grinding machines and grinding Wendt Grinding Machine Laser - mayukhportfolio.co wendt grinding machine laser Laser . price. wendt company grinding

Get Price

Synova lands CHF20 million venture investment - optics.org

* Article updated October 13 Holland Private Equity (HPE), an investment group backed by a major European pension fund manager and also the European Investment Fund, has become the largest external shareholder in Synova, the Swiss company that specializes in a novel Nd:YAG laser-machining technique using a water-jet as a beam guide. The investment, said to be worth “up to” CHF20 million .

Get Price

LDS 200 A - Plastic cutting machine / laser / wafer / cnc .

Find out all of the information about the Synova product: plastic cutting machine / laser / wafer / CNC LDS 200 A. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale.

Get Price

Synova and Disco Hi-Tec Europe co-develop hybrid dicing .

Jun 14, 2007 · LAUSANNE, Switzerland and MUNICH, Germany -- In a move that will greatly broaden global access to its innovative water jet-guided laser technology, Synova today revealed it has entered into a partnership with Munich-based DISCO HI-TEC EUROPE GmbH -- a subsidiary of DISCO Corporation, the leading provider of semiconductor wafer dicing, grinding .

Get Price

LCS-50 - Sai Impex

The LCS 50 is Synova’s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is designed for machining industrial diamond tools and other small work pieces that require precision cutting, drill- ling, grooving or slicing.

Get Price

Grinding Machines Magnetmost - icventicano.it

Edge Grinding Cutting; Synova · LGS – Laser Edge Grinding Machines . . Grinding Machines Magnetmost; Sample Drying And Grinding Machines For Leaves; View this project. Slow Grinding Flow . Home > Grinding Mill Information > small scale industrial slow grinding equipment. . ensure you purchase espresso grind suitable for espresso .

Get Price

Synova's success – Electronics – Case Study

The machines on offer use the water-jet-guided laser technology (also called Laser-Microjet) for various micro-machining operations such as wafer dicing and edge grinding for the semiconductor industry, and cutting of hard materials such as CBN and PCD, PV solar

Get Price

laser microJet Technology - hasmak-t

Synova S.A., headquartered in Duillier, Switzerland, manufactures leading-edge laser cutting systems since 1997 that incorporate the proprietary water jet guided laser technology (laser ®) in a true industrial CNC microJet platform. Customers benefit from significant yield and quality improvements in cutting, as well as enhanced

Get Price

Laser cutting system - saiimpexindia

3-axis machine: 2D cutting, drilling, slicing, grooving 5-axis machine: 3D shaping, cutting, drilling, slicing, edge grinding (K-land edges, single or multiple clearance angles), grooving, milling, chip breaker trenching, engraving, profiling The LCS 50 is Synova’s most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is

Get Price

Synova and DISCO HI-TEC EUROPE to Co-Develop Hybrid Dicing .

Jul 11, 2007 · Fusion of DISCO's Blade Saw With Synova's Water Jet-Guided Laser Technology to Yield Revolutionary Hybrid Dicing Solution LAUSANNE, Switzerland and MUNICH, Germany, June 11 // -- In a move that will greatly broaden global access to its innovative water jet-guided laser technology, Synova today revealed it has entered into a partnership with Munich-based DISCO HI-TEC EUROPE GmbH --

Get Price

GaAs-Wafer Dicing Using the Water jet Guided Laser

Synova SA, Ch. De la Dent-d’Oche, 1024 Ecublens, Switzerland E-mail: [email protected] / Phone: +41 21 694 35 00 / Fax: +41 21 694 35 01 Keywords: laser cutting, water jet guided laser, GaAs, compound semiconductors, thin wafer dicing, edge grinding Abstract Semiconductor wafers are

Get Price

Cutting diamond tools using the Laser MicroJet® technology .

Cutting diamond tools using the Laser MicroJet® technology on a 5-axis machine A. Richmann, S. Kurzen, B. Carron, B. Richerzhagen Synova SA, Chemin de la Dent d’Oche, 1024 Ecublens, Switzerland Abstract The Laser MicroJet® technology uses a water coupled ns-laser to cut various materials e.g. diamond, semiconductors, ceramics and metals.

Get Price

sand wick grinding - keuken310.nl

grinding machines rena - lifeinsurance-southafrica. grinding machines rena blossombuds. sm70 grinding machine used vibrating sieve separatorsm70 grinding machine used Milling is also known as grinding it is a material more refining process RENA grinding machines sand wick grinding grinding machines rena,synova lgs laser edge wet ball mill .

Get Price

SYNOVA introduces its 300 mm (12″) wafers Laser Dicing .

The Laser-Microjet allows outstanding results in cutting, but it can be applied as well for drilling, scribing, grooving, edge grinding, thinning, or marking processes on wafers. The LDS 300 is a cassette-to-cassette machine including fast quality check (control of kerf width, position and roughness).

Get Price

Synova, Makino Offer LMJ/EDM HybridCell | Cutting Tool .

Mar 27, 2017 · To address this need, Synova and Makino are joining forces to offer a unique solution, the HybridCell, which combines the power of Synova’s Laser MicroJet ® (LMJ) with Makino’s leading edge EDM capabilities. It is a fully automated, manufacturing-ready, work cell that can handle a wide range of hole-drilling applications.

Get Price

Inauguration of Laser MicroJet demo center - Today's .

Oct 20, 2014 · Atsugi, Japan – Synova officials announced a new milestone in its strategic cooperation with Makino – the opening of a new Laser MicroJet (LMJ) demo center located in the building of the Makino Atsugi Factory. Representing Synova's largest demo facility up to now, three LMJ systems will be available for demonstrating the technology and showing the capabilities of the machine.

Get Price

Synova Launches Ultra-Precise Laser Machining Center LCS 305

5-Axis Laser MicroJet® cutting system designed to handle sophisticated 3-D applications in tool and aerospace industries Synova, a Swiss-based provider of advanced laser cutting systems, is launching a new CNC machine with full 5-axis capability to process complex three-dimensional geometries.

Get Price

Curlie - Business: Industrial Goods and Services .

Switzerland. Design and manufacture of waterjet guided and fully automatic laser dicing and edge grinding systems for the semiconductor, electronic, medical, energy, and automotive industries. Introduction to technology. Extensive technical information. Multi-lingual library of technical articles and calendar of events on PDF files.

Get Price

Related News...